SK Hynix is the world's first to complete the development of HBM4 and build a mass production system

• We will supply the industry's highest performance HBM4 in a timely manner according to customer schedules to consolidate our competitive advantage

• Compared to HBM3E, its bandwidth has doubled and its energy efficiency has also increased by 40%

• Not only is it a landmark turning point in breaking through the limits of AI infrastructure, but it is also a core product that can solve the technological challenges of the AI era

Seoul, South Korea, September 12, 2025- SK Hynix (or the 'Company'), https://www.skhynix.com ）On the 12th, it was announced that the development of the new high-performance memory product HBM4 * for AI has been successfully completed, and the world's first mass production system has been established.

*High Bandwidth Memory (HBM): A high value-added, high-performance product that connects multiple DRAM vertically and significantly improves data processing speed compared to existing DRAM. HBM DRAM products are developed in the order of HBM (first generation) - HBM2 (second generation) - HBM2E (third generation) - HBM3 (fourth generation) - HBM3E (fifth generation) - HBM4 (sixth generation).

SK Hynix stated that the company has successfully developed the HBM4, which will lead the new era of artificial intelligence, and based on this technological achievement, has built the world's first mass production system for HBM4. This move once again demonstrates the company's leadership position in the field of AI oriented memory technology to the global market

Vice President Zhao Zhuhuan, Head of HBM Development at SK Hynix, said, "The completion of HBM4 development will be a new milestone in the industry. The company will promptly provide customers with products that meet their needs in terms of performance, energy efficiency, and reliability, in order to consolidate its competitive advantage in the AI oriented memory market and shorten the time to market for products

With the increasing demand for AI and data processing, the demand for high bandwidth * storage is also growing rapidly to achieve faster system speeds. In addition, the huge power consumption of data centers has increasingly increased their operational burden, and the energy efficiency of storage has become a key factor demanded by customers. With this, SK Hynix is expected to improve bandwidth and energy efficiency, and HBM4 will become the best solution to meet the requirements.

*Bandwidth: In HBM products, bandwidth refers to the total capacity of data that can be processed per second in an HBM package.

The HBM4, which has newly built a mass production system, adopts 2048 data transmission channels (I/O) that are doubled compared to the previous generation product, doubling the bandwidth and improving energy efficiency by more than 40%. With this breakthrough, the product has achieved the world's highest level of data processing speed and energy efficiency. The company predicts that after introducing this product into customer systems, AI service performance can be improved by up to 69%. This innovation can not only fundamentally solve data bottleneck problems, but also significantly reduce data center power costs.

At the same time, HBM4 has achieved a running speed of over 10Gbps (10 gigabits per second), which significantly exceeds the JEDEC * standard of 8Gbps (8 gigabits per second).

*JEDEC (Joint Electron Device Engineering Council) is an international semiconductor device standards organization that determines the specifications of semiconductor devices

In the development process of HBM4, the company adopted independently advanced MR-MUF * technology and the fifth generation 10 nanometer (1b) DRAM process, which have gained market recognition in terms of product stability, to minimize the risks in its mass production process.

*Mass Reflow Molded Underfill (MR-MUF): After stacking semiconductor chips, in order to protect the circuits between the chips, liquid protective material is filled in to solidify them. According to some evaluations, compared to the method of laying thin film materials on each stack of chips, this technology improves efficiency and heat dissipation. Especially SK Hynix's advanced MR-MUF technology reduces the pressure applied during chip stacking compared to existing technologies, and improves the warp control of chips, which is the key to ensuring stable mass production of HBM.

SK Hynix AI Infra's Chief Marketing Officer, Jin Zhushan, stated, "The official announcement of HBM4, the world's first to build a mass production system, is not only a landmark turning point in breaking through the limits of AI infrastructure, but also a core product that can solve technical problems in the AI era. ”The company will timely supply the highest quality and diversified performance memory required for the AI era, and is committed to becoming a 'Full Stack AI Memory Provider' for AI